Essmetuin SAC305 Sn96.5Ag3.0Cu0.5 217℃ High Temp Tin Lead-Free Solder Paste, No-Clean High Thermal Conductivity And Conductivity Tin Paste For Cell Phone PCB/IC/BGA/SMD CPU Repairing(30G)
Product ID: 571855077
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Description
Essmetuin SAC305 Sn96.5Ag3.0Cu0.5 217℃ High Temp Tin Lead-Free Solder Paste, No-Clean High Thermal Conductivity And Conductivity Tin Paste For Cell Phone PCB/IC/BGA/SMD CPU Repairing(30G)
Specifications
| Manufacturer | ZHUOBAO |
| Item Weight | 1.44 ounces |
| Product Dimensions | 1.32 x 0.92 x 3.72 inches |
| Country of Origin | China |
| Item model number | SAC305 |
| Size | Sn96.5Ag3.0Cu0.5 |
| Material | lead |
| Power Source | fuel_powered |
| Included Components | SAC305 Solder Paste |
| Batteries Included? | No |
| Batteries Required? | No |
Common Questions
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Fast shipping and excellent packaging. The Leatherman tool feels very premium and sturdy.
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